Contracts › 1333ND26CNB030008
1333ND26CNB030008: OU03-FY26-181-NEW Micro Specimens of Electroplated Copper and Micro-Sized Lead-Free Solder for Mechanical Testing to Fracture.
Awarded to Auburn University by National Institute of Standards and Technology (NIST).
$1.0Mobligated
$1.0Mpotential value
30 April 2029current end date
See modifications, all subcontractors and funding in FedSift →
| Contract | 1333ND26CNB030008 |
|---|---|
| Awardee | Auburn University |
| Awarding agency | National Institute of Standards and Technology (NIST) |
| Awarding office | DEPT OF COMMERCE NIST |
| NAICS | 541713 Research and Development in Nanotechnology |
| PSC | 5961 Semiconductor Devices and Associated Hardware |
| Place of performance | AL |
| Offers received | 1 |
| Period of performance | 01 May 2026 to 30 April 2029 |
| Potential end | 30 April 2029 |
| Estimated recompete solicitation | ~Q4 2028 (estimate, ~6 months before expiry) |
Source: USASpending.gov (FPDS), public federal procurement data, as the agency reported it. Our record updated 04 October 2026. The solicitation date is an estimate from the end date, not a posted date.
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