Contracts › 80NSSC24PC199
80NSSC24PC199: Multi-Chip Module Packaging of Sic Pressure Sensors and Electronics
Awarded to Sienna Technologies, Inc. by National Aeronautics and Space Administration.
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| Contract | 80NSSC24PC199 |
|---|---|
| Awardee | Sienna Technologies, Inc. |
| Awarding agency | National Aeronautics and Space Administration |
| Awarding office | NASA SHARED SERVICES CENTER |
| NAICS | 334419 Other Electronic Component Manufacturing |
| PSC | H299 Equipment and Materials Testing- Miscellaneous |
| Place of performance | WA |
| Offers received | 1 |
| Solicitation | 80NSSC24881222Q |
| Period of performance | 26 August 2024 to 31 December 2026 |
| Potential end | 31 December 2026 |
| Estimated recompete solicitation | Now / imminent (estimate, ~6 months before expiry) |
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Source: USASpending.gov (FPDS), public federal procurement data, as the agency reported it. Our record updated 28 October 2026. The solicitation date is an estimate from the end date, not a posted date.
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