Contracts › HQ072725CE002
HQ072725CE002: 25-5A6 Sbir Phase Ii - Analysis and Re-Engineering of Printed Circuit Board Assemblies
Awarded to Tda Research, Inc. by Defense Microelectronics Activity.
$1.3Mobligated
$1.3Mpotential value
02 February 2027current end date
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| Contract | HQ072725CE002 |
|---|---|
| Awardee | Tda Research, Inc. |
| Awarding agency | Defense Microelectronics Activity |
| Awarding office | DEFENSE MICROELECTRONICS ACTIVITY |
| NAICS | 541715 Research and Development in the Physical, Engineering, and Life Sciences (Except Nanotechnology and Biotechnology) |
| PSC | AC11 National Defense R&D Services; Department of Defense - Military; Basic Research |
| Place of performance | CO |
| Offers received | 5 |
| Period of performance | 03 February 2025 to 02 February 2027 |
| Potential end | 02 February 2027 |
| Estimated recompete solicitation | Now / imminent (estimate, ~6 months before expiry) |
Source: USASpending.gov (FPDS), public federal procurement data, as the agency reported it. Our record updated 03 October 2026. The solicitation date is an estimate from the end date, not a posted date.
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