Contracts › SP470125C0090
SP470125C0090: Small Business Innovative Research Sbir Iii to Solve Technologies for Proposal Phiii-0030 for Application of Saipa Technology in Additive Manufacturing for Weapons Sustainment
Awarded to Solve Technology and Research, Inc by Defense Logistics Agency (DLA).
$2.4Mobligated
$2.4Mpotential value
24 March 2027current end date
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| Contract | SP470125C0090 |
|---|---|
| Awardee | Solve Technology and Research, Inc |
| Awarding agency | Defense Logistics Agency (DLA) |
| Awarding office | DCSO PHILADELPHIA |
| NAICS | 541715 Research and Development in the Physical, Engineering, and Life Sciences (Except Nanotechnology and Biotechnology) |
| PSC | AC33 National Defense R&D Services; Defense-Related Activities; Experimental Development |
| Place of performance | FL |
| Offers received | 1 |
| Period of performance | 25 September 2025 to 24 March 2027 |
| Potential end | 24 March 2027 |
| Estimated recompete solicitation | Now / imminent (estimate, ~6 months before expiry) |
Source: USASpending.gov (FPDS), public federal procurement data, as the agency reported it. Our record updated 04 October 2026. The solicitation date is an estimate from the end date, not a posted date.
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