Contracts › SPE7M526P0397
SPE7M526P0397: 8511713440!Circuit Card Assemb
Awarded to Kampi Components Co Inc by Defense Logistics Agency (DLA).
$112Kobligated
$112Kpotential value
16 November 2026current end date
See modifications, all subcontractors and funding in FedSift →
| Contract | SPE7M526P0397 |
|---|---|
| Awardee | Kampi Components Co Inc |
| Awarding agency | Defense Logistics Agency (DLA) |
| Awarding office | DLA LAND AND MARITIME |
| NAICS | 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing |
| PSC | 5998 Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
| Place of performance | PA |
| Offers received | 2 |
| Period of performance | 21 October 2025 to 16 November 2026 |
| Potential end | 16 November 2026 |
| Estimated recompete solicitation | Now / imminent (estimate, ~6 months before expiry) |
Source: USASpending.gov (FPDS), public federal procurement data, as the agency reported it. Our record updated 04 October 2026. The solicitation date is an estimate from the end date, not a posted date.
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