Semiconductor Die Bonding and Vacuum Packaging System

Inactive on SAM.gov · Unrestricted (full and open) · Department of the Navy, DoD · Washington, DC · NAICS 333993 · Solicitation N0017326P2436

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Solicitation details

Solicitation number	N0017326P2436
Notice ID	68c5094fd20d471388d9a1346950e9f7
Agency	Department of Defense (DoD)
Sub-agency	Department of the Navy
Contracting office	NAVAL RESEARCH LABORATORY
NAICS code	333993 — Packaging Machinery Manufacturing
Product / service code (PSC)	3540
Set-aside	Unrestricted (full and open)
Notice type	Award Notice
Posted	15 September 2026
Response deadline	Not stated
Place of performance	Washington, DC, USA
Competition	Competitive

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Description

This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.

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Market context: DoD and NAICS 333993

About the buyer and the industry, not this specific solicitation. Source: USASpending.gov award data, updated nightly.

In fiscal year 2026, DoD obligated $469K across 16 contract actions under NAICS 333993.

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