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Wire Bonder Training and Preventative Maintenance

Inactive on SAM.gov · Unrestricted (full and open) · Defense Microelectronics Activity (DMEA), DoD · CA · NAICS 333242 · Solicitation 26-6E6

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Solicitation details

Solicitation number26-6E6
Notice ID8b3dbeaea3f944b78bb4eb7d2f14dbcf
AgencyDepartment of Defense (DoD)
Sub-agencyDefense Microelectronics Activity (DMEA)
Contracting officeDEFENSE MICROELECTRONICS ACTIVITY
NAICS code333242 — Semiconductor Machinery Manufacturing
Product / service code (PSC)J036
Set-asideUnrestricted (full and open)
Notice typeJustification
Posted13 July 2026
Response deadlineNot stated
Place of performanceCA, USA
CompetitionLikely sole source (FedSift estimate from the notice text) — confirm on SAM.gov before investing in a bid

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Description

Preventative Maintenance and Advanced Training for Wire Bonding specific to KnS products.

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Market context: DoD and NAICS 333242

About the buyer and the industry, not this specific solicitation. Source: USASpending.gov award data, updated nightly.

  • In fiscal year 2026, DoD obligated $214K across 5 contract actions under NAICS 333242.
  • 7 contracts worth $36.0M in this category end within the next 18 months.

DoD contracts under NAICS 333242 →

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