Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.

NASA/NSSC has a requirement for Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs. NASA/NSSC intends to issue a sole source contract to silitronics solutions inc under the authority of FAR 12.102(a). It has been determined that silitronics solutions inc 2388 walsh ave Santa Clara California 95051 1301 United States is the sole provider of Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs. NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Ames Research Center (ARC). The Government intends to acquire Commercial items or services using the provisions, clauses and procedures prescribed in FAR Part 12 for Commercial The NAICS Code for this procurement is 813920. Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 3:00 p.m. Central Standard Time on 8/12/2026. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government. Oral communications are not acceptable in response to this notice. NASA FAR Supplement Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at https://www.hq.nasa.gov/office/procurement/regs/Procurement-Ombuds-Comp-Advocate-Listing.pdf . Primary Point of Contact: Kacey.l.hickman@nasa.gov